Application fields and advantages of low pressure injection molding process
Low pressure injection molding process is a system packaging process that injects hot melt materials into molds at a very low injection pressure (1.5~40bar) and rapidly solidifies them for molding (5~50 seconds). The system consists of materials, molds, equipment and application technologies.
It is mainly used for packaging and protection of precision and sensitive electronic components, including printed circuit boards (PCBs), automotive electronic products, mobile phone batteries, wire harnesses, waterproof connectors, sensors, microswitches, inductors, antennas, loops, etc.
The specific advantages of low-pressure injection molding process are as follows:
1、 Improve the performance of the terminal product, with waterproof sealing, insulation, flame retardancy, high and low temperature resistance, etc
1) Excellent encapsulation protection function;
2) The injection pressure is extremely low, the components are not damaged, and the defective rate is extremely low;
2、 Shorten product development cycle and greatly improve production efficiency
1) The forming die can be cast aluminum die, which is very easy to design, develop, process and manufacture the die, and can shorten the development cycle;
2) The curing process cycle is shortened from 24 hours to 5~50 seconds;
3、 Reduce total production cost
1) Greatly reduce the consumption of packaging materials;
2) Curing without oven, saving energy consumption;
3) Low cost aluminum die can be used instead of steel die;
4) The pouring shell and water cooling system used in the pouring process are omitted;
5) Low pressure and low temperature can greatly reduce the rate of defective parts of finished products and avoid unnecessary waste;
6) Save the shelf, site, corresponding time and labor cost required for heating and curing equipment and processes after potting or natural drying.
